标签：10 used 硬币 纳米 die 模具 工艺 coin
如果我们粗俗地把每个晶体管看作边长为10nm的正方形，那么100亿个的面积是：
100 * 108 * 10 * 10-9 * 10 * 10-9 = 10-6 平米 = 1平方毫米
铁壳里面是die，不像1平方毫米的样子。
Orin is a 17 billion transistor chip, almost double the transistor count of Xavier and continuing the trend of very large, very powerful automotive SoCs. NVIDIA is not disclosing the manufacturing process being used at this time, but given their timeframe, some sort of 7nm or 5nm process (or derivative) is pretty much a given. And NVIDIA will definitely need a smaller manufacturing process – to put things in comparison, the company’s top-end Turing GPU, TU102, takes up 754mm2 for 18.6B transistors, so Orin will pack in almost as many transistors as one of NVIDIA's best GPUs today.
A coin die is one of the two metallic pieces that are used to strike a coin, one per each side of the coin. A die contains an inverse version of the image to be struck on the coin. Striking a coin refers to pressing an image into the blank metal disc, or planchet, and is a term descended from the days when the dies were struck with hammers to deform the metal into the image of the dies. 硬币模具是用来铸造硬币的两块金属片之一，硬币的每一面各有一块。模具包含要在硬币上铸造的图像的反向版本。敲击硬币是指将图像压入空白金属圆盘或板条中，并且是一个术语，从模具用锤子敲打的时间下降到将金属变形成模具的图像。
清·范寅《越谚·数目之谚》：「板板六十四，铸钱定例也，喻不活。」 【释义】宋时官铸铜钱，每板六十四文，不得增减。
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. 在集成电路中，die是一小块半导体材料，在其上制造给定的功能电路。通常，通过光刻等工艺，在电子级硅（EGS）或其他半导体（如砷化镓）的单个晶圆上批量生产集成电路。晶圆被切割成许多块，每一块都包含一个电路副本。每一块都被称为die。
die n.
- "small cube marked on each face with spots numbering from one to six, used in gaming," early 14c. from Old French de "die, dice,"
- Sense of "engraved stamping block or tool used for stamping a softer material" is from 1690s.
六级/考研单词: invert, descend, hammer, integrate, fabricate, batch, silicon, cube
标签：10,used,硬币,纳米,die,模具,工艺,coin 来源： https://www.cnblogs.com/funwithwords/p/15893517.html
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